Blog

PCIe PCB Design Specifications! (Recommended for Bookmarking)

PCI-Express (Peripheral Component Interconnect Express) Design Specifications for PCB

PCI-Express (Peripheral Component Interconnect Express), formerly named "3GIO", is a high-speed serial computer expansion bus standard proposed by Intel in 2001. It aims to replace the legacy PCI, PCI-X, and AGP bus standards.
PCIe features high-speed serial point-to-point dual-channel transmission with dedicated bandwidth allocated to each connected device (no shared bus bandwidth). Key supported functions include active power management, error reporting, end-to-end reliable transmission, hot-swapping, and Quality of Service (QoS).
The following are the design specifications for PCIe PCBs:
  1. The trace length from the edge of the gold finger to the PCIe chip pins shall be limited to 4 inches (approximately 100mm).
  2. PCIe PERP/N, PETP/N, and PECKP/N are three differential pairs. Ensure proper isolation: maintain a 20mil spacing between differential pairs and between differential pairs and all non-PCIe signals to minimize harmful crosstalk and Electromagnetic Interference (EMI). Avoid high-frequency signals on the reverse side of the chip and PCIe signal traces; a full ground plane (GND) is recommended.
  3. The length difference between the two traces in a differential pair shall not exceed 5mil, with length matching required for every segment of the two traces. Use a 7mil trace width and 7mil spacing between the two traces in each differential pair.
  4. When PCIe signal pairs change layers, place ground vias near the signal vias—1 to 3 ground vias per signal pair are recommended. Use 25/14 vias for PCIe differential pairs, and the two vias must be symmetrically placed.
  5. PCIe requires AC coupling between the transmitter and receiver. The two AC coupling capacitors for a differential pair must have the same package size, be symmetrically placed, and located close to the gold finger. The recommended capacitance is 0.1μF, and through-hole packages are prohibited.
  6. Signals such as SCL shall not route through the PCIe main chip.       
Proper trace design enhances signal compatibility and reduces signal reflection and electromagnetic loss. PCIe bus signals use high-speed serial differential communication; therefore, adhering to the routing requirements and specifications for high-speed differential pairs is critical to ensuring reliable PCIe bus communication.
PCIe is a dual-simplex point-to-point serial differential low-voltage interconnect. Each lane consists of two differential signal pairs: transmit pair (Txp/Txn) and receive pair (Rxp/Rxn). These signals operate at 2.5 GHz with an embedded clock, which simplifies routing rules by eliminating length matching requirements across different differential pairs.
As PCIe serial bus transmission rates continue to increase, designing to minimize insertion loss and jitter budget becomes particularly important. In PCIe backplane design, the primary routing challenge lies in these differential pairs. Figure 1 illustrates key specifications for PCIe high-speed serial differential pair routing, including four common fan-in/fan-out configurations (labeled A, B, C, and D). Configuration A (symmetrical pin fan-in/fan-out) offers the best performance, followed by D, while B and C are viable alternatives. Below is a summary of key considerations for PCIe LVDS signal routing:
Figure 1: PCIe Differential Pair Routing Specifications
(1) For adapter cards or slots, the trace length from the gold finger edge/slot pins to the PCIe Switch pins shall not exceed 4 inches. Additionally, long-distance traces should be routed diagonally on the PCB.
(2) Avoid reference plane discontinuities such as splits and gaps.
(3) When LVDS signals change layers, ground vias must be placed close to the signal vias—at least 1 to 3 ground vias per signal pair are required. Never route traces across plane splits.
(4) Minimize trace bends to avoid introducing common-mode noise, which degrades differential pair signal integrity and increases EMI. All trace bends shall have an angle of ≥135 degrees. Maintain a spacing of ≥20mil between differential pair traces, and the minimum length of bent segments shall be ≥1.5 times the trace width.
When serpentine traces are used for length matching (as shown in Figure 2), each long bend segment must be at least 15mil (3 times the 5mil trace width). The maximum distance between serpentine bends and the other trace in the differential pair shall not exceed twice the normal differential pair spacing.
Figure 2: Serpentine Routing
(5) The length difference between the two data traces in a differential pair shall be within 5mil, with length matching required for every segment. Length matching should be implemented near the location of the length discrepancy (see Figure 3). Note that length matching is not required between transmit and receive pairs—only within individual differential pairs. A spacing of 5mil or 10mil is allowed in the fan-out area. Traces within 50mil do not require a reference plane. Length matching should be placed close to signal pins and achieved using small-angle bends.
Figure 3: PCIe Differential Pair Length Matching Design
To minimize length mismatch, the number of left bends should be as equal as possible to the number of right bends. When serpentine traces are used for length matching, each long bend segment must be ≥3 times the trace width. The maximum distance between serpentine bends and the other trace in the differential pair shall be ≤ twice the normal differential pair spacing. Additionally, when multiple bends are used for length matching to a single pin, the length of the unmatched segment shall be ≤45mil.
(6) PCIe requires AC coupling between the transmitter and receiver, with coupling capacitors typically placed close to the transmitter.
The two AC coupling capacitors for a differential pair must have the same capacitance value, package size, and symmetric placement. If possible, transmit differential pairs should be routed on the top layer. Capacitance values shall range from 75nF to 200nF, with 100nF preferred. Surface-mount device (SMD) packages such as 0402 are recommended; 0603 is acceptable, but through-hole packages are prohibited. The input and output traces of the capacitors for the two signals in a differential pair shall be symmetrical. Minimize trace separation during matching, and keep the length of traces separating the differential pair to the pins as short as possible.
 
Why are different test frequencies/voltages used to test the capacitance of capacitors, given their different capacitance ranges?

Why are different test frequencies/voltages used to test capacitance for different capacitance ranges?

The frequency setting of the instrument depends primarily on the parasitic components of the component. For more accurate component testing, the SRF (Self-Resonant Frequency) measurement frequency of the component should be avoided. Industry users set standards for different frequency points based on capacitance values ​​(Table 1). Capacitances above 10uF are considered within the tantalum capacitor range. Therefore, as the ceramic capacitance range begins to expand to the tantalum capacitor range, the industry applies the frequency standards for tantalum capacitor measurements to ceramic capacitors.

The applied voltage also depends on the capacitor's capacitance. Typically, a voltage of 1.0 ± 0.2 Vrms is applied for 10uF and below. However, for above 10uF, the applied voltage is 0.5 ± 0.2 Vrms. High-capacitance capacitors have extremely low impedance; therefore, to supply sufficient current for measurement, the power supply needs to provide more current than that supplied with 1.0 ± 0.2 Vrms. Therefore, by reducing the applied voltage, the power supply will be able to provide sufficient current to accurately measure high-capacitance capacitors.

Class Type Capacitance Frequency Voltage

Class I 1,000pF and under 1MHz ± 10% 0.5 ~ 5 Vrms Over 1,000pF 1kHz ± 10%

Class II 10uF and under 1kHz ± 10% 1.0 ± 0.2 Vrms Over 10uF 120Hz ± 20% 0.5 ± 0.2 Vrms

Nexperia 16474 models (MOS, transistors, ICs, IGBTs) , SPQ,MOQ and (COO) Certificate of Origin lookup

Nexperia 16474 models (MOS, transistors, ICs, IGBTs) , SPQ,MOQ and (COO) Certificate of Origin lookup

Nexperia 10911 diodes SPQ,MOQ and (COO) Certificate of Origin lookup

Nexperia 83 IGBTs and modules SPQ,MOQ and (COO) Certificate of Origin lookup

Nexperia 4244 logic ICs (74 series) SPQ,MOQ and (COO) Certificate of Origin lookup

Nexperia 1236 MOS (BUK series, etc.) SPQ,MOQ and (COO) Certificate of Origin lookup

This is an excerpt of the table starting with a model number; please download the attachment to view the complete data.

Nexperia 10911 diodes (COO) Certificate of Origin lookup
BL DescriptionBookpartSPQMOQLT WKSCOO
Bipolar Discretes1N4531,113100005000012China
Bipolar Discretes1N4531,133100005000012China
Bipolar Discretes1N4531,14350005000012China
Bipolar Discretes1N4728A,11350003000012China
Bipolar Discretes1N4728A,13350003000012China
Bipolar Discretes1N4729A,11350003000012China
Bipolar Discretes1N4729A,133500030000 China
Bipolar Discretes1N4730A,11350003000012China

etc.

 

 

Nexperia 83 IGBTs and modules (COO) Certificate of Origin lookup
BL DescriptionBookpartSPQMOQLT WKSCOO
Wide Band Gap IGBT and ModuleGAN039-650NBBHP100010008Philippines
Wide Band Gap IGBT and ModuleGAN039-650NTBJ1000100016Philippines
Wide Band Gap IGBT and ModuleGAN039-650NTBZ1000  Philippines
Wide Band Gap IGBT and ModuleGAN041-650WSBQ3003008China
Wide Band Gap IGBT and ModuleGAN063-650WSAQ300300 Philippines
Wide Band Gap IGBT and ModuleGAN080-650EBEZ250025008China
Wide Band Gap IGBT and ModuleGAN111-650WSBQ30030033China
Wide Band Gap IGBT and ModuleGAN140-650EBEZ250025008China

 

etc.

 

Nexperia 4244 logic ICs (74 series) (COO) Certificate of Origin lookup
BL DescriptionBookpartSPQMOQLT WKSCOO 
ICS74ABT00D,1182500250018China 
ICS74ABT00PW,1182500250018China 
ICS74ABT04D,1182500250014China 
ICS74ABT04PW,1182500250018China 
ICS74ABT08D,1182500250018China 
ICS74ABT08PW,1182500250018China 
ICS74ABT125BQ,1153000300016China 
ICS74ABT125D,6232500500018China 

 

etc.

 

Nexperia 1236 MOS (BUK series, etc.) (COO) Certificate of Origin lookup
BL DescriptionBookpartSPQMOQLT WKSCOO
MOS Discretes2N7002,21530004800014China
MOS Discretes2N7002,235100005000014China
MOS Discretes2N7002/HAMR30004800014China
MOS Discretes2N7002AKM-QYL100004000016China
MOS Discretes2N7002AK-QR30006900014China
MOS Discretes2N7002AKQB-QZ50001500012China
MOS Discretes2N7002AKRA-QZ50002000012China
MOS Discretes2N7002AKS-QX30002700014Malaysia

etc.

High quality aerospace circuit board disassembly using Xilinx chips

① On the circuit board, manually soldered joints can be seen connected to movable wires, but their ability to withstand repeated vibrations is definitely not as good as connectors (even those with leads)
② This is a space board that has already been put into use and was only dismantled later
③ It uses chips from Xilinx, which has been acquired by AMD and has become a subsidiary of AMD
④ What are the standards for aerospace circuit board levels? Have any industry partners shared them

Current humanoid robots have an intelligence equivalent to a one-year-old child, and they navigate amidst controversies surrounding remote control and counterfeiting.

Recently, images of humanoid robots running on the track and performing at exhibitions have gone viral. However, many observant viewers noticed that the engineers were still holding remote controls! The debate over whether "remote control equals fraud" is intensifying online and in the media. Today, we'll specifically discuss the issue of remote control of humanoid robots and fraud. Behind this lies a cognitive gap between technological progress and public expectations.

What is a one-year-old baby like? Robots are like that now.

Just like a one-year-old learning to walk, they need adults to support and protect them, and if they fall, they need to be picked up immediately. Humanoid robots are similar: they can take a few steps and pick things up on their own, but they rely on a "remote control" as an "invisible crutch." For example, when humanoid robots are trained in factories, they can perform tasks such as inspecting car door locks and affixing car stickers, but they must first go through the three steps of "perception-planning-execution." Autonomous decision-making in open environments is something the world hasn't yet mastered. An experienced worker in the industry gave an analogy: a robot's "cerebellum" can control balance and joint movement, but its "brain" gets confused when faced with complex situations—just like a baby can imitate walking, but is prone to falling if not being led by an adult.

Remote control isn't fraud; it's a "learning tool" for growth.

Some say "using remote control is deception," but Academician Han Guangjie said that remote control is more like an "emergency button," allowing engineers to take over and ensure safety when the robot suddenly becomes confused. Whether humanoid robot manufacturers are fraudulent depends on their advertising. If they claim "fully autonomous" operation while relying on remote control, that's fraud. If they're honest and the remote control is a "learning tool" during development, like a parent helping a toddler learn to walk, that's the proper approach. Think about it: robots learn skills through "imitation-practice-autonomy." Tesla's Optimus and Zhiyuan Yuanzheng A2 do this, collecting data through human "hands-on" teaching to form an evolutionary loop of "teaching-training-autonomy." This isn't technological regression; it's an essential part of growth.

From "learning to walk at one year old" to "walking independently," there are still hurdles to overcome.

Humanoid robots need to overcome several obstacles to walk independently without a remote control. Firstly, technically, the A2 robot from Zhiyuan Robotics, capable of traversing 100 kilometers across provinces, relies on multi-sensor fusion of dual GPS, LiDAR, and infrared depth cameras. While it can recognize complex terrain and avoid crowds, it is prone to misjudging situations and requires alerts. Secondly, in terms of safety, human-robot mixed environments require safety measures. For example, CloudMinds uses a cloud-based brain system to ensure remote intervention when robots make mistakes. Thirdly, in terms of industry, humanoid robots entering factory workshops must first overcome challenges such as cross-scene migration and small-sample learning. Currently, the robotics industry is moving towards "Level 3," aiming to handle most scenarios autonomously and only call for human assistance in complex situations. Experts predict that achieving fully autonomous "Level 4 and Level 5" robots will require another 3-5 years of development.

Controversy is a wake-up call, but also an opportunity.

This debate has also served as a reminder to the industry: technology must allow for trial and error, but communication must be transparent. Manufacturers must be honest and not mislead with claims of "fully autonomous" technology; the public must also understand that new technologies, like toddlers learning to walk, need room to grow. With breakthroughs in technologies like multimodal perception and reinforcement learning, humanoid robots will eventually need to "retire" once they reach 5 or 6 years old. Currently, robots are in a critical "learning-to-walk" stage. Controversy isn't a bad thing; it forces the industry to become more standardized. Technology hasn't been idle either, constantly pushing forward. As Pang Jianxin said, the development of humanoid robots will take three steps: first, performing limited tasks in structured scenarios; second, learning to accompany and interact; and finally, entering the home. Currently, UBTECH's training at Geely's factory and the A2 robot's cross-province journey are both examples of "learning to walk." When robots can, as Lu Junguo said, accompany the elderly and care for children in the home, that will be true "independence."

 

The process of a robot learning to walk is similar to that of a toddler learning to walk. First, it needs support to walk, then it gradually learns to walk independently. It can't be rushed, and it can't be faked. Don't you agree? If we are more patient and accept its "dependency" like we do with a toddler learning to walk, and if companies focus on solid research and development, robots will eventually be able to "run" on their own, entering factories, shopping malls, and even our homes.

 

 

 

As we all know, the design of humanoid robots is in full swing in both China and the United States. So, what chips are used in China's humanoid robots?

Chips used in humanoid robots designed in China are functionally classified into core categories covering critical links such as decision-making, motion control, and perception. Key mainstream models are detailed below:

AI Decision-Making Chips (The "Brain")

  • International: NVIDIA Jetson Orin, Jetson AGX Thor.
  • Chinese Brands: Rockchip RK3588, Horizon Robotics Journey A2000 (Huashan Series), among others, are making significant strides in this sector.

Motion Control Chips (The "Cerebellum")

  • International: Texas Instruments (TI, U.S.) TMS320F28377D, STMicroelectronics (ST, Europe) STM32H7 series are widely adopted.
  • Chinese Brands: HPMicro HPM6E00, GigaDevice GD32H75E, etc., meet the microsecond-level synchronous control requirements for multi-joint systems.

Visual Sensing Chips (The "Eyes")

  • International: Sony (Japan) IMX series are common 2D vision CMOS chips.
  • Chinese Brands: Orbbec Femto series iToF chips, OmniVision (China) global shutter image sensors, enabling high-precision 3D perception and dynamic image capture.

Communication Interface Chips (The "Data Neural Network")

  • International: NXP S32K39, Infineon LAN9252 are widely used.
  • Chinese Brands: Create Bright Technology EtherCAT slave control chips, Youtai Micro low-latency Ethernet chips, adapting to high-real-time transmission needs.

Power Management Chips (The "Energy Heart")

  • International: Texas Instruments (TI, U.S.) BQ27546, Analog Devices (ADI) LTC3880 dominate the market.
  • Chinese Brands: Eastchip Semiconductor DK87XXBD series, SGMICRO high-precision power management chips, suitable for wide-voltage and fast-charging scenarios.

Memory Chips (The "Memory Center")

  • Chinese Brand: GigaDevice SPI NOR Flash GD25LX series, with a data throughput of 400MB/s, can meet the requirements of fast robot code reading and program startup.              
Analysis of the Duration of the Market Price Increase Cycle for the Popular Component MT53E512M32D1ZW-046 WT:B1
 What to do when customers are always a step behind the market?

Last week, a friend who dabbles in the memory storage market mentioned that he believes prices in the storage market always exhibit a time-lag effect. For instance, for a certain component: in the first week, when he quoted 5 US dollars, the customer only accepted 3 US dollars; in the second week, when he quoted 8 US dollars, the customer agreed to 5 US dollars; by the third week, when he offered 12 US dollars, the customer was willing to accept 8 US dollars... In fact, this scenario indicates that the component is in an upward price cycle. Today's peak becomes tomorrow's low. Take the MT53E512M32D1ZW-046 WT:B1 as shown —its "tearful sale price" at the end of October turned out to be a "steal" in mid-November. In just three weeks, the price nearly tripled, and by last weekend, quotes for this component had reached 30 US dollars.
So what's the allure of trading components in such upward price cycles? It lies in locking in orders when the price is between 1 and 9 (on a hypothetical scale), say at 3 or 4, then selling when it climbs to 7 or 8. Within just two to three weeks, you can secure a price difference of two to three times, or even more. This is the reason why stockpilers are so drawn to this practice.
Of course, it’s crucial to analyze data carefully and avoid overcommitting during downward price cycles. As for the critical turning point of this round of ups and downs in the storage market, current comprehensive market assessments—combined with the explosive news of ChangXin Memory Technology launching DDR5 (which may effectively deter further fires at certain foreign storage factories)—have led some players to predict that this storage market rally may last until April-June next year (market information is for reference only and not an authoritative conclusion).
In fact, this phenomenon isn’t unique to the storage sector; many practices in the broader IC (Integrated Circuit) industry follow a similar pattern. For example, during the upward price cycles of ADI and Nexperia this year, it was common for channels and suppliers to engage in order flipping and price hikes. Seasoned players would choose to collaborate closely with channels to profit together; otherwise, they’d be merely acting as intermediaries relying solely on industry connections. However, acting as an intermediary is particularly challenging in the storage market, as it requires significantly larger capital investment. Many small and micro IC intermediaries simply lack the financial capacity to participate—this is why you may watch the memory market soar daily but struggle to enter it.

 


('Carrying baskets'is the image of the public's'reverse trading'of traders
Statement-It is like "carrying a basket"to transfer goods between different markets andentities,without directly creating physical value(such as production and research anddevelopment),but by identifying and capturing opportunities for supply-demand mismatch,achieving short-term transfer of ownership of goods and making profits.
In academic contexts,similar concepts include "middlemanarbitrage,""speculative trading,"and "spread trading
Trading),But 'basket lifting'emphasizes more on operationalflexibility and asset light attributes(no need for self ownedwarehouses or production lines,relying on funds and channels).

Wingtech Technology Co., Ltd. Responds Strongly! New Statement on Nexperia Netherlands Issues
On November 23rd, Wingtech Technology released the "Statement Urging Nexperia Netherlands to Earnestly Respond to Communications and Resolve the Control Right Issue to Safeguard the Stability of the Global Supply Chain" on its official WeChat public account.

Statement Urging Nexperia Netherlands to Earnestly Respond to Communications and Resolve the Control Right Issue to Safeguard the Stability of the Global Supply Chain

Wingtech TechnologyNovember 23rd, 2025 18:42 JiangsuRecently, we have noticed a series of unilateral actions by Nexperia Netherlands and its related parties, which have posed potential threats to the stability of the global semiconductor industry chain. To prevent the situation from further escalating and safeguard the legitimate rights and interests of all parties, our company hereby issues the following statement:Since the improper intervention by the Dutch Ministry of Economic Affairs, adhering to the principle of responsibility and safeguarding the interests of global customers, with the strong assistance and promotion of relevant Chinese government departments, we have taken the initiative to show goodwill and clearly expressed our willingness to conduct constructive communications with Nexperia Netherlands on how to restore Wingtech Technology's legitimate control rights and properly resolve the current disputes. We have always believed that resolving differences through candid dialogue is a practical and correct approach to ensuring the normal operation of the company and the stability of global chip supply.However, it is deeply regrettable and puzzling that despite our utmost sincerity, Nexperia Netherlands has so far not made any substantive response to our communication proposals.In view of this, we request Nexperia Netherlands to put forward constructive and truly sincere solutions on how to restore Wingtech Technology's legitimate control rights and complete shareholder rights on the basis of earnestly respecting facts and laws.The stability of the global semiconductor industry is crucial to the overall development of the industry. We once again call on all parties to act in a rational and responsible manner, jointly safeguard the stability and prosperity of Nexperia Semiconductor, and ensure the supply chain security of global customers.Wingtech Technology Co., Ltd.November 23rd, 2025
Source: Wingtech Technology's official WeChat public account
This is Wingtech Technology's third official statement since the Netherlands announced on November 19th that it had "suspended its intervention in Nexperia Semiconductor". The specific content and timeline are as follows:
On November 19th, Wingtech Technology released the "Progress Report on the Operation and Management of Subsidiaries". The announcement stated that the ministerial order suspended as referred to in the statement by the Minister of Economic Affairs and Climate Policy of the Netherlands is the order issued by the Ministry of Economic Affairs and Climate Policy of the Netherlands to Nexperia on September 30th, 2025 (Netherlands time). This ministerial order requires Nexperia and all its global 30 entities including subsidiaries, branches, and offices to refrain from making any adjustments to their assets, intellectual property rights, businesses, and personnel, with a validity period of one year.
Although the aforementioned ministerial order has been announced as suspended, the emergency measures ruled by the Enterprise Court on October 7th, 2025 (Netherlands time) remain in effect and have not been affected by the suspended ministerial order in any way. All emergency measures of the Enterprise Court as explained in the company's announcement on October 13th are still ongoing, and the company's control over Nexperia is still restricted. Investors are advised to pay attention to investment risks.
On November 20th, Wingtech Technology released the "Statement by Wingtech Technology on the Suspension of the Administrative Order by the Dutch Ministry of Economic Affairs" on its official WeChat public account. The statement pointed out that although the administrative order has been announced as suspended, the emergency measures issued by the Enterprise Court of the Amsterdam Court of Appeal in the Netherlands have not been lifted. The Dutch Ministry of Economic Affairs is obligated to thoroughly and comprehensively resolve the Nexperia Semiconductor issue, and Wingtech Technology's complete rights as a shareholder and its legitimate control over Nexperia must be restored.

Statement by Wingtech Technology on the Suspension of the Administrative Order by the Dutch Ministry of Economic Affairs

Wingtech TechnologyNovember 20th, 2025 21:15 JiangsuWingtech Technology Co., Ltd. (hereinafter referred to as "Wingtech Technology" or "our company") has noticed the statement issued by the Minister of Economic Affairs and Climate Policy of the Netherlands (hereinafter referred to as "the Dutch Ministry of Economic Affairs") on November 19th, 2025, stating that it has "suspended the implementation of the administrative order issued to Nexperia on September 30th, 2025 in accordance with the Goods Availability Act". As the sole controlling shareholder of Nexperia Semiconductor, Wingtech Technology attaches great importance to this and hereby makes the following response regarding relevant matters:

I. Our Company's Position on the Decision of the Dutch Ministry of Economic Affairs

We have noticed that the above-mentioned statement by the Dutch Minister of Economic Affairs was issued after consultations between the Ministry of Commerce of the People's Republic of China and the Dutch Ministry of Economic Affairs. We sincerely thank the Ministry of Commerce of the People's Republic of China for its tremendous efforts in resolving the Nexperia Semiconductor issue and the current China-Netherlands consultations. The Dutch Minister of Economic Affairs' expression of suspending the administrative order reflects to a certain extent its attitude of facing up to the current problem, which we believe is the first step towards properly resolving the issue. The Dutch Ministry of Economic Affairs' suspension of the administrative order itself also indicates the illegality and impropriety of its previous actions.
It should be clarified and stated that although the administrative order has been announced as suspended, the emergency measures issued by the Enterprise Court of the Amsterdam Court of Appeal in the Netherlands (hereinafter referred to as "the Enterprise Court") have not been lifted. The restrictions and infringements on the legitimate rights and interests of Chinese shareholders and personnel are still ongoing. The Dutch Ministry of Economic Affairs only announced the suspension of the administrative order, evading the erroneous ruling of the Enterprise Court, which was promoted by it, to deprive Wingtech Technology of control over Nexperia, and failed to address the key to solving the problem.

II. The Dutch Ministry of Economic Affairs is Obligated to Thoroughly and Comprehensively Resolve the Nexperia Semiconductor Issue

The administrative order issued on September 30th, 2025 is only the beginning of a series of actions by the Dutch government. After the issuance of the administrative order, the Dutch Ministry of Economic Affairs personally participated in the Enterprise Court proceedings initiated by some European management of Nexperia Semiconductor, claimed itself as an interested party, and deeply participated in and even dominated the entire process. On October 1st, 2025, the Dutch Ministry of Economic Affairs submitted a letter of support to the Enterprise Court; on October 6th, 2025, it submitted supporting defense statements to the Enterprise Court and sent lawyers to attend the hearing, clearly stating that it could not determine whether Nexperia would comply with the previous administrative order, thus calling for "the rapid intervention of the Enterprise Court to avoid this situation". With the participation and strong promotion of the Dutch Ministry of Economic Affairs, the Dutch Enterprise Court, without giving Chinese shareholders a reasonable opportunity to present their cases, arbitrarily made emergency measures on October 7th, 2025, such as suspending the positions of Chinese directors and placing almost all shares held by Chinese parties in custody (with Chinese parties retaining only 1 share). The administrative order of the Dutch Ministry of Economic Affairs and the emergency measures of the Enterprise Court are complementary in means, consistent in goals, and coordinate with each other—systematically and illegally depriving Wingtech Technology of its legitimate rights and interests as the 100% shareholder of Nexperia. It is evident that the Dutch Ministry of Economic Affairs is not only the "initiator" of the entire incident but also the "behind-the-scenes pusher" of the Enterprise Court proceedings.
At present, the emergency measures issued by the Enterprise Court have not been lifted, and the control of Nexperia has not been returned to its legitimate owner.

III. Wingtech Technology's Complete Rights as a Shareholder and Its Legitimate Control Over Nexperia Must Be Restored

Although the Dutch Ministry of Economic Affairs' decision to suspend the administrative order is the first step towards properly resolving the issue, it is by no means a solution to this incident. We urge the Dutch Ministry of Economic Affairs to face up to the essence of this incident and correct its mistakes as soon as possible and thoroughly. It should not only permanently revoke the administrative order issued based on the Goods Availability Act and withdraw its participation in and support for the Enterprise Court but also ensure that the legitimate control rights of Chinese shareholders and the legitimate rights of Chinese personnel are restored, and Nexperia is returned to the state before September 29th, 2025.
We firmly demand that any true solution must be based on restoring Wingtech Technology's complete rights as a shareholder and its legitimate control over Nexperia. Wingtech Technology will never accept any attempt to "legalize" illegal results, nor will it accept a "new normal" of Nexperia's equity and governance created through illegal procedures. We will take all legal means to maximize the protection of the legitimate rights and interests of our company and all shareholders.
Wingtech TechnologyNovember 20th, 2025
Source: Wingtech Technology's official WeChat public account
On November 23rd, Wingtech Technology released the "Statement Urging Nexperia Netherlands to Earnestly Respond to Communications and Resolve the Control Right Issue to Safeguard the Stability of the Global Supply Chain" on its official WeChat public account.
The statement said that the company has noticed a series of unilateral actions by Nexperia Netherlands and its related parties, which have posed potential threats to the stability of the global semiconductor industry chain.
"It is deeply regrettable and puzzling that despite our utmost sincerity, Nexperia Netherlands has so far not made any substantive response to our communication proposals," the statement said. In the statement, Wingtech Technology requested Nexperia Netherlands to put forward constructive and truly sincere solutions on how to restore Wingtech Technology's legitimate control rights and complete shareholder rights on the basis of respecting facts and laws.
The following is a collation of information recently released by some official and authoritative media since the occurrence of the Nexperia incident:
On November 1st, China announced exemptions for eligible exports of Nexperia Semiconductor.
On November 2nd, Nexperia China issued an announcement letter to customers stating that Nexperia Netherlands unilaterally decided to stop supplying wafers to the packaging and testing factory (ATGD) located in Dongguan starting from October 26th, 2025.
On November 7th (local time), the Dutch government stated that China will soon resume chip supply.
On November 8th, China agreed to the request of the Dutch Ministry of Economic Affairs to send personnel to China for consultations.
On November 13th, Jiemian News reported that according to automotive industry officials, Nexperia Semiconductor's Dutch branch has not been transporting silicon wafers to its Chinese subsidiary for assembly.
On November 13th, Dutch Minister of Economic Affairs Karelmans stated in an interview with The Guardian that he had "no regrets" about the Netherlands' decision to take over Nexperia on September 30th.
On November 14th, the Dutch Minister of Economic Affairs stated that a Dutch government delegation will travel to China "early next week" to seek a solution to the issue regarding Nexperia Semiconductor, a subsidiary of Chinese company Wingtech Technology.
On November 14th, the Ministry of Commerce responded to Karelmans' remarks in the interview: China expressed extreme disappointment and strong dissatisfaction with such remarks that confuse right and wrong, reverse black and white, and act arbitrarily. The Dutch Ministry of Economic Affairs declined to comment on the same day.
On November 17th (local time), DutchNews reported that a Dutch delegation is visiting China this week.
On November 19th, Dutch Minister of Economic Affairs Karelmans issued a statement on social media platform X, stating that he had "suspended intervention in Nexperia Semiconductor".
On November 19th, Wingtech Technology announced that the company's control over Nexperia is still restricted.
On November 19th, the Ministry of Commerce: China welcomes the Netherlands' initiative to suspend the administrative order on Nexperia Semiconductor, believing it is the first step in the right direction towards properly resolving the issue, but there is still a gap from addressing the root cause of the turbulence and chaos in the global semiconductor production and supply chain.
In addition, the wafer issue has not yet been resolved.
[Case Study] The Secret in the Crack: A Metallographic Analysis of a Varistor!

OnePcba conducted a full-process incoming inspection on a varistor in accordance with customer requirements. In addition to routine appearance screening, the laboratory focused on "anatomical" structural verification through Cross Section (section analysis) to accurately check the integrity of the internal structure of the component.

Section analysis is a core technology for micro-detection of electronic components: through steps such as resin encapsulation curing, precision grinding, and mirror polishing, the internal structure details are finally presented intuitively with a metallographic microscope (magnification 50~500x). Its advantage lies in capturing tiny defects that cannot be identified by the naked eye and conventional detection.

For varistors, the "safety valves" of circuits, the significance of section detection is particularly critical. As the core of voltage protection in scenarios such as automotive electronics and power modules, even micron-level cracks, bubbles, or voids inside them may become "invisible bombs" for electrical breakdown and functional failure.

 

The test results showed that multiple samples had obvious crack and void defects, and the specific risk mechanisms are as follows:

  • Crack defects: Mainly caused by sintering stress in the production process, mechanical impact during transportation, or thermal stress caused by temperature fluctuations. Under high-voltage surge scenarios, arc discharge and local overheating are prone to occur at cracks, which may轻则 cause resistor functional failure, and重则 trigger circuit short circuits, threatening the safety of subsequent equipment.
  • Void defects: Mostly caused by uneven shrinkage of resin materials during packaging and gas residue during curing. Voids will reduce local heat dissipation efficiency and cause electric field concentration effect, which accelerates device aging under repeated voltage shocks and significantly shortens service life.

In fields such as automotive electronics (e.g., BMS battery management systems, radar sensors) and medical electronics that require "zero tolerance" for reliability, such potential defects are completely unacceptable. Once the device fails, it may cause serious consequences such as vehicle safety failures and medical equipment shutdowns.

This case profoundly reveals that the reliability of electronic components has never been a "number game on the parameter table", but a quality core hidden in the microstructure.

Every section analysis is an in-depth diagnosis of the "health status" of components; every test report of OnePcba is a quality protection wall built for the customer's supply chain. In the follow-up, we will continue to share special detection points of other components such as capacitors and chips, so stay tuned.

You think Japan's semiconductor industry has declined? Actually, it's hiding behind the scenes, holding the lifeline of the global semiconductor industry in its hands.

Here's the gist:

“Japan is no longer the star of chip-making, but it is the ‘water and air’ that keeps every fab alive—whoever controls the equipment and materials sets the rules, and that still means Tokyo.”


1. Bottom line first: Japan is not a “chip giant,” yet it is the bloodstream of the world’s wafer fabs.  
In chip design and wafer foundry (think TSMC, Samsung) Japan isn't in charge anymore – they don't make as many or have the newest tech. But they're still big players in two important areas:

- Semiconductor equipment  
- Semiconductor materials  

Short version: the world’s fabs could keep the lights on without Japan, but they would slowly starve.

2. Where exactly is Japan unbeatable? (engineer-level breakdown)

2.1 Equipment – not ASML, but holding a stack of critical tools  
Japanese vendors (Tokyo Electron, Hitachi High-Tech, SCREEN, etc.) own ~30 % of the global fab-equipment market, second only to the U.S. Look inside a typical line and you will meet:

- Coat/develop, wet clean, etch, CVD/ALD: TEL, SCREEN, Hitachi High-Tech  
- Inspection & metrology: CD-SEM, defect review, X-ray—again Japanese boxes  

Translation: most of the recipes you run are qualified on Japanese hardware. That gives Japan loud voice in tool roadmaps, process windows and yield ramps.

2.2 Materials – the real chokepoint  
Japan controls roughly 50 % of the world’s semiconductor-materials market and dominates 14 of the 19 key classes:

- Silicon wafers (Shin-Etsu, SUMCO)  
- Photoresist / BARC (JSR, TOK, Fujifilm)  
- CMP slurry & pads (Fujimi, Hitachi Chemical)  
- EMC, underfill, leadframes for packaging  
- High-purity acids, solvents, gases  

So every photon, every polishing pad, every wafer cassette you touch has probably crossed the Sea of Japan at least once.

3. What about “made-in-Japan” chips?

3.1 From king to niche  
In the 1980s Japan held ~50 % of global semiconductor sales and crushed U.S. vendors in DRAM. Trade wars, DRAM price crashes, and slow conglomerate decisions later, it exited the memory race and lagged in advanced logic.

3.2 Where it still wins today  
  - Car MCUs, power devices, sensors (Renesas, ROHM)

  - Industrial / very reliable analog stuff

  - NAND flash (Kioxia)

Not 3 nm headlines, but AEC-Q100 Grade 0 and 30-year product lifecycles.

4. Why is everyone courting Japan again?

4.1 Geopolitics + supply-chain security  
With >90 % of leading-edge logic sitting in Taiwan, the U.S., EU and allies need a “safe node.” Japan offers political stability, deep manufacturing roots and alignment on export controls. Carve up the map and Japan becomes the designated lifeboat.

4.2 Tokyo is writing checks  
METI has earmarked > USD 20 bn since 2021:

 Rapidus – trying to make 2 nm logic chips in Hokkaido with IBM's help, planning to start in 2027

  - TSMC Kumamoto – giving big subsidies for making car and specialty chips

For engineers this means new fabs, new pilot lines, and a tight loop between tool/material vendors and the fab next door.

5. What does this mean to you as an engineer?

5.1 Process realization  
Every OPC tweak, etch bias shift or CMP dishing fix ends with a Japanese AE sending you a new recipe. Joint-development projects with TEL, JSR or Shin-Etsu are daily life.

5.2 Supply-chain risk  
Remember 2019: Japan restricted fluorinated polyimide, resist and HF to Korea—Samsung and SK hynix had <90 days of buffer. Dual-sourcing now starts with “can we get this outside Japan?”

5.3 Career & ecosystem  
Japan is moving from “backstage supplier” to “front-row manufacturer + platform.” If you care about:

- Putting together processes for advanced chips or SiC/GaN power chips

- Engineering equipment with very precise control

- Doing research on materials where even tiny amounts of impurities matter

…then Japan offers fabs, vendors and a reliability culture that trains you to think in six-sigma by reflex.

6. Human-sentence summary  
If the global semiconductor industry were a data-center:

- The USA designs the processors

- Taiwan & Korea run the servers

- Europe makes the optical switches

- Japan provides the power supplies, cables, screws, and coolant—you don't see them, but if you shut them off, the whole place goes down.

Why has the price of tantalum capacitors suddenly increased? What are the reasons?

The two price increase notices from the Taiwanese passive component giant Yageo's subsidiary KEMET in April and October this year directly caused a stir in the industry. Tantalum capacitors, which are somewhat "niche" compared to ceramic capacitors, have been pushed into the spotlight. What is causing the price increase of tantalum capacitors? What is the current reaction in the spot market? What are tantalum capacitors? What kind of segment market is this?

Yageo's two price increase notices, Source: Reader's social media feed

01

Successive Price Hikes for Passive Component Tantalum Capacitors by Manufacturers

To understand these issues, we must start with Yageo's two price increase notices. In October, KEMET issued a tantalum capacitor price increase notice to customers, primarily due to a significant increase in demand for its Polymer Tantalum Capacitor product line (KO-CAP) across multiple key market segments over the past three years, coupled with rising pressures from labor, material, and equipment costs. Therefore, price adjustments will be implemented for large case size products. Effective November 1st, price increases will apply to the T520, T521, T530 series, suitable for case sizes D, V, X, Y, with voltage ranges from 2.5V to 25V, and other related series of polymer tantalum capacitors. The supply chain revealed that this price increase is as high as 20-30%.

KEMET's April price increase notice indicated that over the past three years, demand for the polymer tantalum capacitor product line (KO-CAP) had significantly increased in multiple key market areas. Faced with rising labor, material, and equipment costs, maintaining profitability for legacy part numbers (especially case size B) was difficult, leading to price increases for some specifications in the polymer tantalum capacitor product line, effective June 1. At that time, the supply chain indicated the increase was in the double-digit percentage range.

It is reported that compared to the first price increase in June, the November adjustment extends from distributors to direct sales customers, covering a broader scope. Additionally, the June increase primarily targeted small and medium case size, low-voltage, and legacy specification products, mainly due to cost pressures. The November increase, however, is not only due to cost pressures but also focuses on large case size, high-voltage products, which are key components in high-end applications like AI servers and GPU power modules.

Although Yageo's tantalum capacitor price hikes are the most discussed, Yageo is not actually the first to raise prices. Circulated price increase notices show that some domestic manufacturers, Panasonic, and AVX (Kyocera) have also successively raised prices over the past year (subject to official announcement):

December 1, 2024: Xiangjiang raised prices for standard tantalum capacitors by 20%. Reason: Production and operation planning.
April 1, 2025: Panasonic raised prices for polymer tantalum capacitors. Reason: Increase in raw material and production costs, some part numbers increased by up to 25%.
May 27, 2025: Xinyun raised prices for tantalum capacitors. Reason: Price increases for metals like tantalum and silver.
June 1, 2025: KEMET raised prices for polymer tantalum capacitors. Reason: Rising labor, material, equipment costs, primarily for case size B.
June 8, 2025: Kyocera AVX raised prices for standard tantalum capacitors. Reason: Increased raw material tantalum costs.
September 19, 2025: Kyocera AVX raised prices for standard tantalum capacitors. Reason: Increased raw material tantalum costs.
October 22, 2025: KEMET raised prices for polymer tantalum capacitors. Reason: Rising labor, material, equipment costs, primarily for case sizes D, V, X, Y.

Circulated Kyocera AVX Tantalum Capacitor Price Increase Notice, Source: Reader's social media feed

Behind such a widespread price increase for tantalum capacitors, manufacturers have pointed to a common reason: rising costs of the raw material tantalum metal.

Tantalum powder and tantalum wire are key raw materials for manufacturing tantalum capacitors. Approximately 60%-65% of global tantalum (in the form of powder and wire) is used in tantalum capacitors, making tantalum capacitors the largest downstream application for tantalum metal. Because of this, tantalum capacitors are highly dependent on the tantalum metal supply chain.

From the resource perspective, global tantalum resources are highly concentrated, and prices have obvious cyclical characteristics with significant fluctuations.

Global tantalum mine production in 2024 was about 2100 tons, with the Democratic Republic of Congo (DRC) ranking first with about 880 tons, accounting for about 42%; Rwanda about 17%; Brazil about 10%.

Imbalances in global tantalum supply and demand over the past 20+ years have repeatedly caused significant price fluctuations. Data from Guohai Securities shows that before 2010, tantalum ore prices were around $30-45/lb. After the global economic recovery from the financial crisis, prices reached a historical high of $135/lb in 2011. Later, due to factors like US-China trade friction and the COVID-19 pandemic, prices fluctuated again, rising above $100/lb before subsequently falling. This year, affected by conflicts in the DRC region, tantalite prices surged impulsively, reaching around $90/lb by September.

Overall, high concentration of tantalum resources, sensitive supply-demand dynamics, and frequent geopolitical and macroeconomic disturbances create the highly volatile characteristic of tantalum prices. This year's widespread price increases for tantalum capacitors are attributed by various manufacturers to factors such as rising upstream raw material prices and increased demand from certain downstream sectors. KEMET noted in its price increase notice that demand for its tantalum capacitors has grown significantly in multiple key end markets (such as AI, detailed later),叠加 various cost increase factors.

This year, the tantalum capacitor spot market demand has also experienced some fluctuations due to widespread manufacturer price hikes.

Manager Fu, who mainly deals in AVX tantalum capacitors, told us that their customers are mostly traders, with some end customers involved. The relevant original manufacturers issued price increase notices in June this year. Before that, in April-May, market demand indeed increased, especially in April when demand was highest, basically customers would buy upon quotation. There was another wave of price increases in June due to the notices, and the recent wave was in October with KEMET's second notice. But now, towards the end of the year, overall demand is not as strong as it was in April-May. This year, tantalum capacitor demand has increased somewhat, but performance has only seen a slight increase.

Another tantalum capacitor distributor said they handle both domestic and international brands, with wide application coverage. There was indeed a wave of activity after the Chinese New Year this year. Prices rose significantly in the second half of the year, and as year-end approaches, customer demand is better than before.

Regarding prices, Manager Fu stated that March-April saw the most drastic price increases. Many people in the market were stocking up, and prices kept rising until May-June when large quantities arrived, causing prices to drop slightly, but they remain higher than conventional levels last year. Taking the AVX general-purpose tantalum capacitor TAJA106K016RNJ as an example, the unit price was around 0.33 yuan before March-April, rose to 0.48 yuan in March-April, dropped to around 0.42 yuan in May-June, and is now around 0.4 yuan by the end of November.

Regarding lead times, according to Future Electronics' 2025 Q4 Market Outlook Report, lead times for polymer tantalum capacitors from multiple manufacturers like AVX, Vishay, Panasonic are showing signs of extension, with deliveries affected by AI applications. A distributor added that AVX's standard tantalum capacitor lead time is 16 weeks, and currently standard tantalum capacitor lead times have reached 16-20 weeks, slightly longer than the standard lead time.

Source: Future Electronics

Multiple tantalum capacitor distributors indicated that although tantalum capacitor prices have indeed risen, the market situation is also influenced by other factors, such as competition within the industry and changes in demand. Overall, compared to the price increase trend, the performance increase is relatively less pronounced.

A contact dealing with both domestic and international brands said their customers are mainly in the security and communication fields. This year, due to restricted exports to Europe and the US, demand has decreased significantly, coupled with weak domestic demand, the overall market is very competitive.

A contact mainly promoting domestic tantalum capacitors said, "Performance hasn't improved much this year, it feels like there are more competitors." Their demand comes from communications, medical, and industrial control sectors. Tantalum capacitor demand has increased this year, but some market share was taken by aluminum capacitors. Domestic price changes have not been significant. There has been an increase in requests for replacements this year, mainly coming from those using AVX, while few requests come from those using KEMET, as there isn't much stock in the market.

One distributor saw increased demand this year, receiving many inquiries for Vishay tantalum capacitors, mainly for use in AI, but actual transactions were few, with generally low accepted prices. Vishay is the most expensive brand among tantalum capacitor brands.

Overall, compared to chips, the application scale of tantalum capacitors is relatively small, and the fluctuations caused by price increases are not that frenzied. Moreover, tantalum capacitors can be replaced by other passive components in some cases, or substituted with domestic alternatives. A procurement professional who frequently buys AVX and KEMET told us that prices for these brands have increased this year, and customer demand has decreased compared to last year. Except for automotive, industrial, and medical applications, some customers in the consumer field have already switched to domestic alternatives.

02

What is the Tantalum Capacitor Market Like?

How are the Key Players Performing?

The tantalum capacitor market is highly concentrated, primarily dominated by a few international manufacturers who master the core technologies. Among them, KEMET holds the top global market share for tantalum capacitors. In 2020, Yageo acquired KEMET, expanding its product portfolio and doubling its global footprint, significantly enhancing its strength in the tantalum capacitor field. Following KEMET are AVX (a Kyocera subsidiary, 26% market share), Panasonic (14% market share), Vishay (10% market share), etc. Domestic tantalum capacitor manufacturers mainly include Zhenhua Xinyun Electronics, Torch Electron, and Hongda Electron.

Source: Yageo 2024 Financial Report

 

In the passive components field, capacitors, inductors, and resistors constitute the three major product categories, with capacitors having the largest scale, accounting for about 65% of the entire passive components market. Tantalum capacitors are one of the four core categories within capacitors (Ceramic / Aluminum Electrolytic / Tantalum / Film Capacitors).

 

Tantalum capacitors have higher costs and a smaller market share (12%) compared to the other three capacitor types. However, tantalum capacitors offer high reliability, low leakage current, stable performance, and extremely high electric field strength, making them suitable for scenarios requiring high capacitor reliability, such as industrial and military fields, possessing advantages that are difficult for the other three capacitor types to replace.

 

According to Market Reports World, consumer electronics is the largest segment for tantalum capacitors, accounting for over 35%. Among smartphones shipped in 2023, about 43% used at least one tantalum capacitor. The automotive industry further drives this growth; in 2023, over 96 million vehicles were produced globally, with 45% of them embedding tantalum capacitors in ADAS and infotainment systems.

Tantalum capacitors can be divided into two main types: standard tantalum capacitors and polymer tantalum capacitors. Standard tantalum capacitors use manganese dioxide as the electrolyte, have higher ESR, and average ripple current withstand capability. Polymer tantalum capacitors use conductive polymer as the electrolyte, have lower ESR, can withstand higher currents, offer more stable performance, and are safer.

The shift towards polymer technology for standard tantalum capacitors is the current development direction, constantly adapting to market needs. Compared to MLCCs (ceramic capacitors), polymer tantalum capacitors easily achieve higher capacitance ranges (e.g., 1000μF -- 2200μF) with a price advantage. For example, in NVIDIA's Blackwell AI servers GB200 and GB300, Vishay-produced polymer tantalum capacitors are extensively used to achieve minute-level discharge. The usage of tantalum capacitors per AI server is 2-8 times that of traditional servers, with the proportion of polymer tantalum capacitors increasing to 50%, and usage in high-end models equipped with GB200 even exceeds 10 times.

Market Reports World data shows that the global tantalum capacitor market size was valued at approximately $2.59 billion in 2024, and is projected to reach $4.32 billion (about RMB 30.7 billion) by 2033, with a compound annual growth rate (CAGR) of 5.9% from 2025 to 2033. The Asia-Pacific region leads consumption with over 52%, driven mainly by growth in the electronics and automotive industries.

The tantalum capacitor market is not large; compared to the scale of ceramic capacitors, which is tens of billions of dollars, it is considered a small market within the capacitor industry. However, it excels in its high specialization, high barriers to entry, and high value, playing a role in some critical scenarios.

By looking at the latest performance of the four major tantalum capacitor manufacturers - Yageo (KEMET), Kyocera (AVX), Panasonic, and Vishay - we can glimpse the application trends of their products.

Yageo (KEMET): Strong AI Demand Momentum

Yageo is the leading passive component manufacturer from Taiwan. Over the years, through mergers and acquisitions, it has continuously expanded its product lines, becoming the world's largest chip resistor (R-Chip) and tantalum capacitor manufacturer, and the third largest multilayer ceramic capacitor and inductor manufacturer.

Before acquiring KEMET, Yageo primarily focused on MLCC and resistor products. After acquiring KEMET in 2020, its product structure rapidly expanded to comprehensively cover "Resistors + Capacitors + Inductors/Magnetic Components," particularly strengthening the layout of tantalum capacitors and high-end capacitor products. This achieved an upgrade from a single passive component type to a full range, and from the general market to the high-end market, contributing significantly to Yageo's profits. During its peak period (2021‑2022), the gross profit margin remained around 38%.

From 2020 to the present, although Yageo's performance has fluctuated, it has reached a relatively high level this year. KEMET's substantial price increases may further boost Yageo's performance.

According to Taiwanese media reports, the two price increases prove that Yageo has successfully extended its product portfolio into higher-end, higher-margin niche markets. In the first half of 2025, polymer tantalum capacitors already accounted for 22% of Yageo's revenueThis price increase is beneficial for directly boosting its revenue and profitability. Tantalum capacitors were traditionally mainly used in notebook products, industrial, and automotive applications. With the surge in AI server demand, the strongest growth this year comes from AI applications. Yageo previously pointed out that the company's Book-to-Bill ratio averages above 1, especially in the AI application field, reaching 1.2 to 1.3, indicating strong AI demand momentum.

 

Source: Yageo Financial Report

In the first three quarters of this year, Yageo's consolidated revenue was NT$96.962 billion, a year-on-year increase of 5.78%. The gross profit margin increased by 1.1 percentage points year-on-year to 35.8%. The third quarter, in particular, benefited from demand for AI and high-end application products, with net profit attributable to the parent company reaching NT$6.356 billion, hitting a high since Q4 2022, a quarter-on-quarter increase of 27.2% and a year-on-year increase of 12.9%. Looking ahead, Yageo's customer inventory has reached healthy levels, and demand for AI products continues to grow.

 

Kyocera (AVX): Polymer Tantalum Capacitor Order Volume is Increasing

AVX is a wholly-owned subsidiary of Kyocera and a global leading supplier of various products including electronic components, connectors, and sensors. AVX belongs to Kyocera's Electronic Components Business division, which accounts for 17.6% of Kyocera's total revenue.

The semi-annual report released by Kyocera on September 30 this year showed that capacitor demand in the Electronic Components division grew in both information & communication and automotive markets. However, affected by the continued appreciation of the Yen against the US Dollar, sales revenue for the reporting period decreased by 3.4% year-on-year.

Kyocera mentioned in its 2024 annual report that due to the expansion of the AI and SSD markets, order volumes for polymer tantalum capacitors are increasing. Product certification at the Thailand factory is underway, and production scale expansion is planned from April 2025.

Panasonic: Strong AI Server Capacitor Orders Continue

Panasonic is a globally leading comprehensive electronic solutions provider. Panasonic's capacitor products belong to the Industrial Division, which accounts for 15% of total revenue.

Panasonic announced its Q2 FY2026 (July-Sept 2025) financial results. Sales growth in the Industrial Division was driven by continuously growing demand for information and communication applications (such as AI servers), leading to increased product (capacitors, multilayer circuit board materials) sales. Profit grew, mainly due to increased product sales for information and communication applications, price adjustments, etc.

 

Source: Panasonic Financial Report

Panasonic emphasized that orders for polymer tantalum capacitors (Conductive polymer capacitors) used in AI servers remain strong.

 

Panasonic Capacitor Product Book-to-Bill Ratio, Source: Panasonic Financial Report

Vishay: Increased Smart Grid Infrastructure Sales, Continued Growth in AI Server Orders

Vishay is one of the world's largest manufacturers of discrete semiconductors and passive electronic components. NVIDIA's GB200 GPU cluster, with single-unit power consumption exceeding 2000W, uses Vishay's polymer tantalum capacitors. Orders for Vishay's vPolyTan already account for over 70% of its 2025 capacity, and lead times have extended to 3-6 months.

Vishay's Q3 2025 revenue was $790.6 million, of which Capacitors revenue was $130 million, accounting for 16.4%.

 

Vishay Capacitors Net Revenue, Book-to-Bill Ratio, Gross Margin, and Operating Margin for five quarters from FY2024 Q3 to FY2025 Q3 (left to right) (Unit: $ thousand)

 

Vishay's Historical Revenue Changes

Vishay stated in a recent earnings call that Q2 revenue in the Industrial segment grew by 2%, mainly benefiting from deliveries of capacitors for smart grid infrastructure projects led by European and Chinese automotive OEMs. The industrial market is showing signs of recovery in Q3. As new AI server power supply projects enter mass production, the company observes continuous growth in order volume. In Q3, they continued to expand customer coverage, providing product support for more AI customers. The product coverage rate for capacitors has improved, and certification work for polymer tantalum capacitors is steadily advancing.

03

Conclusion

This year, almost all major tantalum capacitor manufacturers have successively raised prices. As the leading tantalum capacitor manufacturer, Yageo's single price increase reached as high as 30%, inevitably reminding the market of the轰轰烈烈的 MLCC price surge years ago, speculating whether this is a repeat of the "old play." However, judging from the reasons for price increases announced by various manufacturers, the pressure from upstream raw material costs indeed exists objectively, and the new demand brought by emerging applications like AI cannot be ignored either. The underlying reasons are probably more complex.

In fact, recently, price increase voices across the entire passive components industry have been rising one after another; not only are capacitors rising, but products like inductors are also following suit. For example, Fenghua Advanced Tech explicitly stated in its latest price increase notice that costs for various metal materials like silver, tin, copper, bismuth, and cobalt continue to rise; the Taiwanese inductor giant Taico also announced price increases for multilayer chip beads and inductors. With these back-and-forth price adjustments, the passive components industry has suddenly become "lively." We will continue to monitor market performance regarding how subsequent market demand changes.