HDI PCB Products

4-layer 1-stage HDI PCB

Layer: 4

Thickness: 1.6 mm

Material: FR4 TG170

Copper: Outer 2 oz, Inner 3 oz

Surface: Immersion gold 2U"

Application: Consumer electronics

Minimum hole: 0.15 mm

Minimum line width: 3.6mil

Line spacing: 4.2 mil

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8L 2+N+2 PCB

Layer: 8

Thickness: 2.0 mm

Material: ITEQ 180

Construction: 2+4+2 HDI PCB

Copper: Outer 3 OZ, Inner 5 OZ

Surface: Immersion gold 2U"+ OSP

Application: Communication

Minimum hole: 0.1 mm

Minimum line width: 3 mil

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10layer 3 stage HDI Printed circuit board

Layer: 10

Thickness: 2.6 mm

Material: EM-825

Construction: 3+4+3 HDI PCB

Copper: Outer 6 OZ, Inner 2 OZ

Surface: ENIG

Application: Military

Minimum blind/Buried hole: 0.1 mm/0.15mm

Minimum line width: 3.6mil

Line spacing: 3.6mil

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18layer High frequency and high speed PCB

Layer: 18

Thickness: 1.2 mm

Material: ISOLA

Construction: 2+16+2 HDI PCB

Copper: Outer 3 OZ, Inner 2 OZ

Surface: ENIG

Application: Automotive Electronics

Minimum blind/Buried hole: 0.15 mm/0.1mm

Minimum line width: 3.3mil

Line spacing: 3.3mil

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26-layer Industrial Control PCB

Layer: 26

Thickness: 3 mm

Material: ITEQ 180

Construction: 3+20+3 HDI PCB

Copper: Outer 6 OZ, Inner 6 OZ

Surface: ENIG

Application: Industrial control

Minimum blind hole: 0.1mm

Minimum line width: 3mil

Line spacing: 3.2mil

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32-layer Multilayer PCB

Layer: 32

Thickness: 6 mm

Material: KB 6160

Copper: Outer 2 OZ, Inner 3 OZ

Surface: ENIG 3U

Application: Communication

Minimum hole: 0.15mm

Minimum line width: 3.1mil

Line spacing: 3.6mil

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